Photoresist develop (AZ P4400) |
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| Batch sizes |
200 mm: 1, 75 .. 200 mm: 4 |
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| Developer Agent that reacts with masking layer (e.g., photoresist) to etch it selectively. |
AZ 400K |
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| Material |
AZ P4400 |
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| Sides processed |
both |
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| Temperature |
25 °C |
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| Wafer size |
|
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| Equipment |
Develop bench |
| Equipment characteristics: |
| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat, no-flat, notched |
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| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
alumina, gallium arsenide, glass (category), metal (category), sapphire, silicon, silicon on insulator |
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| Wafer thickness List or range of wafer thicknesses the tool can accept |
200 .. 3000 µm |
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