Process Hierarchy

  Photoresist develop (AZ P4400)
Batch sizes 200 mm: 1, 75 .. 200 mm: 4
Agent that reacts with masking layer (e.g., photoresist) to etch it selectively.
AZ 400K
Material AZ P4400
Sides processed both
Temperature 25 °C
Wafer size
Wafer size
Equipment Develop bench
Equipment characteristics:
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat, no-flat, notched
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
alumina, gallium arsenide, glass (category), metal (category), sapphire, silicon, silicon on insulator
Wafer thickness
List or range of wafer thicknesses the tool can accept
200 .. 3000 µm