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How to Start
About MEMS
Cover seal: View
Process Hierarchy
Bonding
Clean
Consulting
Deposition
Doping
Etch
LIGA
Lift off
Lithography
Mask making
Metrology
Miscellaneous
Packaging
Polishing
Process technologies
Thermal
Unique capabilities
If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at
engineering@mems-exchange.org
or call us at (703) 262-5368
Cover seal
Process characteristics:
Encapsulation material
Specify preferred epoxy sealant material (if known).
Encapsulation material
LaNiO3 (LNO)
1165 PR remover
496K PMMA
950K PMMA
97% 3-Methacryloxypropyltriethoxyline
ABS_plastic
acetic acid
acetic acid/phosphoric acid/water [1:1:30]
acetone
air
AIT cool grease 7016
Alloy 42
alumina
Alumina / Zinc oxide (Al2O3/ZnO) alloy
aluminosilicate
aluminum
aluminum nitride
aluminum oxide
aluminum/copper [99.5:0.5]
aluminum/neodymium [99:1]
aluminum/silicon [98:2]
aluminum/silicon [99:1]
aluminum/silicon/copper [98:1:1]
ammonia
ammonium
ammonium hydroxide
ammonium persulfate
amorphous silicon
amorphous silicon on quartz
amorphous silicon on silicon
amorphous silicon on silicon dioxide
Arch OiR 620-7i
Arch OiR 897-10i
Arch OiR 897-12i
Arch OiR 906-17
argon
argon/hydrogen
arsenic
Ashland's 16:1:1:2 Aluminum Etch
AZ 1512
AZ 1518
AZ 312/water [1:1]
AZ 327 MIF
AZ 351 developer
AZ 400K
AZ 4330
AZ 4620
AZ 5214
AZ 5214e
AZ 7900
AZ 9245
AZ 9260
AZ developer
AZ HiR 1075
AZ nLOF 2070
AZ P4210
AZ P4400
AZ P9260
AZ300T
AZO
BARC
barium strontium titanate (BST)
BBr3 doping
BCB 3022-63
BCB 4024-40
BCB 4026-46
Beryllium Copper
BK7
Black epoxy paint
Borofloat (Schott)
boron
boron trichloride
borophosphosilicate glass
borophosphosilicate glass on silicon
Bosch process
BPSG
brass
bromotrifluoromethane
BSG
C4F8
carbon
carbon dioxide
carbon tetrafluoride
carbon tetrafluoride/hydrogen
CD26
ceramic
chlorine
chloropentafluorethane
chromium
chromium (transparent)
chromium/aluminum
chromium/gold
chromium/gold/chromium
cobalt
copper
Corning 1737
Corning 7070 Glass
Corning Eagle 2000
Crystalbond 555
Cupric oxide (black)
Cyantek CR-14 (acetic acid/ceric ammonium nitrate [8%:22%])
DDMS
diamond
diborane
Diced wafer material
dichlorosilane
DS2100
Durimide 112A
Durimide 115A
Durimide 32A
Durimide 7520
Dynachem OFPR
Dynasol 165
EKC 265
emulsion
Epotec H20E
ethylenediamene pyrocatecol
Forming Gas (N2/H2)
FOTS (fluoroctatrichlorosilane)
Foturan (Schott)
freon
fused silica
Futurrex NR5-8000
Futurrex NR9-8000
Futurrex RD6
gallium arsenide
gallium nitride
gallium phosphide
germanium
GG
glass (Hoya)
glass (spin-on)
glass-ceramic
gold
gold (nano-porous)
gold/tin
gold/titanium
graphite
H2O2
hafnium dioxide
HBr
HCl [2.2%]
HCl [2.5%]
HCl [4%]
HCl/hydrogen peroxide/water [1:1:5]
HCl/Water/HF
helium
HF
HF (buffered)
HF [49%]
HF/nitric acid
HF/water [1:10]
HF/water [1:1]
HF/water [1:50]
HMDS
HNO3/H2O/HF [50:20:1]
HR200 photoresist
HTO on SiN on HTO
HTR- D2 developer
hydrogen
hydrogen chloride
II-VI
III-V
indium
indium phosphide
indium tin oxide
indium tin oxide on quartz
iridium
Iron
iron oxide
isopropyl alcohol
Isotropic silicon etchant (HN03 /H2O / NH4F)
J.T. Baker 80-15-3-2 (CMOS Grade)
J.T. Baker Buffered Oxide Etchant 5419-03 VLSI Grade
kapton
KOH
Kovar
lanthanum aluminate
LaSFN9
LDD 26W
lead
lead/tin solder
lithium niobate
Magnesium fluoride
Magnesium oxide
Mercat (MCT, CMT, MerCadTel, MerCad Telluride)
methane
methanol
methanol/carbon dioxide/air
MF-319
MF-701
Micro-90
MicroChem SU-8 Developer
Microchrome Tech - CEP200
Microposit 1165
Microposit 351
MIF300 developer
molybdenum
MP developer
NanoGetter
NaOH/hydrogen peroxide
Nichrome
Nichrome on quartz
nickel
nickel on quartz
nickel/cobalt/iron
nickel/silicon
NiFe
niobium
nitric acid / acetic acid / sulfuric acid / DI water
nitric acid/HF/water [1:2:1]
nitride on silicon
nitrocellulose
nitrogen
nitrous oxide
NMP
none
NR1-6000PY
NTO
O2, CF4
OCG 825 35CS
OCG 897-12i
OCG 897-21i
OCG 897-7i
OCG 934
Olin OPD 4262
other
oxidized silicon
oxygen
oxygen/carbon tetrafluoride
palladium
palladium/nickel
Parylene C
Parylene N
PEEK
permalloy
PET
Phosphate Glass
phosphine
phosphoric acid
phosphoric acid [85%]
phosphoric acid/nitric acid/acetic acid
phosphorus
phosphoryl chloride
phosphosilicate glass
phosphosilicate glass (low temperature)
phosphosilicate glass on silicon
photoresist (G-line)
photoresist (negative) on silicon dioxide
photoresist (positive) in silicon dioxide
photoresist and gold
photoresist on quartz
photoresist on silicon
photoresist on silicon dioxide
photoresist on silicon nitride
photoresist/chromium/gold
PI2610
PI2611
PI2613
PI2771
piranha
plating base metal
platinized silicon
platinum
platinum on quartz
platinum on silicon dioxide
PMMA
PMMA with MMA
poly-Germanium
poly-SiC
poly-Silicon-Germanium
polycarbonate
polyester
polyethylene
polyimide CG 284
polyimide on silicon
polyimide on silicon nitride
polymer/photoresist
polypropylene
polysilicon
polysilicon (n-type)
polysilicon (p-type)
polysilicon (phosphorus doped)
polysilicon on quartz
polysilicon on silicon dioxide
polystyrene
Polytetrafluoroethylene (PTFE)
potasium iodide/ iodine
PPFC - Plasma polymerized fluorocarbon
ProTEK B1-18
ProTEK primer
PRS 2000
PRS 3000
PRX-127
Pyrex (Corning 7740)
PZT
quartz (fused silica)
quartz (single crystal)
RD6 Resist Developer
RER 600
rhodium
Rogers R/Flex 8080
RR4 Resist remover
ruthenium
sapphire
SF4 Glass
Shipley 1045
Shipley 1075
Shipley 1805
Shipley 1811
Shipley 1812
Shipley 1813
Shipley 1818
Shipley 1827
Shipley 220
Shipley 3612
Shipley MIF
Shipley Remover 1112A
Shipley SJR 5740
Shipley SPR220-3
Shipley SPR220-7
Shipley SPR700 1.2
Shipley SPR955 CM-0.9
Shipley SPR955 CM-2.1
Shipley Ultra i-123
Shipley UV210
Shipley UV6
Sichrome
silane
silicon
silicon (doped)
silicon (high-resistivity)
silicon (single crystal)
silicon and unknown
silicon carbide
silicon dioxide
silicon dioxide (low temperature)
silicon dioxide on silicon
silicon germanium
silicon nitride
silicon nitride on quartz
silicon nitride on silicon
silicon nitride on silicon dioxide
silicon on insulator
silicon on sapphire
silicon oxy-nitride
silicon with metal
silicon, glass, metal
silicon/glass composite
silver
SIMOX
soda lime
sodium carbonate [1% wt]
ST-22
stainless steel
steam
SU-8
sulfur hexafluoride
sulfuric acid/hydrogen peroxide
sulfuric acid/hydrogen peroxide [4:1]
sulfuric acid/hydrogen peroxide [98:2]
sulfuric acid/hydrogen peroxide [9:1]
SVC 14
T1100
tantalum
tantalum nitride
tantalum oxide
TaSi
TEOS
TEOS/polymer
tin
titanium
titanium nitride
titanium oxide
titanium/aluminum
titanium/nickel
titanium/tungsten
titanium/tungsten 0.13um + aluminum 0.44um
TMAH
Tracon Tra-bond 2151
Tracon Tra-bond 2254
Transene Aluminum Etchant -Type D
Transene Aluminum Etchant Type A (phosphoric acid/nitric acid/acetic acid)
Transene Copper etchant (APS 100)
Transene Copper etchant (CE-200)
Transene Gold TFA
Transene Nichrome TFN
Transene Nickel TFB
Transene Titanium etchant (TFTN)
trifluoromethane
tungsten
tungsten hexasilicide
tungsten silicide
ULE
unknown
vacuum
vanadium
VM652
water
white crown
white crown (zinc-borosilicate)
xenon difluoride
YSZ (Yttria-Stabilized Zirconia)
Zeonor
ZEP 520
Zerodur
zinc
zinc oxide
zirconium dioxide
ZnSe
Specify preferred epoxy sealant material (if known).
Equipment
