Process Hierarchy

on front
  Spectroscopic ellipsometry film thickness measurement
Batch size 1
Materials silicon dioxide, silicon nitride
Process duration 15 min
Sides processed either
Thickness 0.01 .. 5 µm
Wafer size
Wafer size
Equipment Gaertner Scientific Ellipsometer
Equipment characteristics:
Wafer holder
Device that holds the wafers during processing.
vacuum chuck
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
Wafer thickness
List or range of wafer thicknesses the tool can accept
200 .. 1000 µm
  • Other substrates such as gallium arsenide and glass may be used. However, the values of N and K for the desired substrate should be provided.