Process Hierarchy

on front
  Optical Front-to-Front Alignment
Alignment side front
Sides processed either
Wafer size
Wafer size
Equipment EVG 420 Aligner
Equipment characteristics:
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat, no-flat
Wafer holder
Device that holds the wafers during processing.
metal chuck
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
quartz (single crystal), silicon on insulator, silicon, Pyrex (Corning 7740)
Wafer thickness
List or range of wafer thicknesses the tool can accept
100 .. 3000 µm