Process Hierarchy

  EDP Etch
Process characteristics:
Depth of material removed by etch process
Depth of material removed by etch process, must be 0 .. 550 µm
0 .. 550 µm
Batch size 1
Edge profile
Free form text field for description of edge profile
54.7 degrees
Etch rate 80 µm/hour
Solutions and their concentrations.
ethylenediamene pyrocatecol
Material silicon
Primary material removal rate divided by removal rates of secondary materials (i.e., factors by which primary material is removed faster than secondary materials)
silicon: 1
Sides processed both
Temperature 110 °C
Wafer size
Wafer size
Equipment Acid hood
Equipment characteristics:
Wafer holder
Device that holds the wafers during processing.
teflon chuck
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
Wafer thickness
List or range of wafer thicknesses the tool can accept
50 .. 1000 µm
  • Feature edges need to be aligned with the <100> and <010> planes.