Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
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  Down Stream Plasma Descum
Process characteristics:
Material
Material
Depth 0 .. 10 µm
Etch type dry isotropic
Gas Oxygen, H2N2, CF4
Sides processed either
Temperature 110 °C
Wafer size
Wafer size
Equipment Axcelis Down Stream Plasma Asher / Stripper
Equipment characteristics:
Batch sizes 100 mm: 25, 150 mm: 25
Wafer holder
Device that holds the wafers during processing.
 cassette
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
 silicon on insulator, sapphire, quartz (fused silica), silicon
Wafer thickness
List or range of wafer thicknesses the tool can accept
 250 .. 800 µm