Process Hierarchy

on front
  Silicon DRIE
Process characteristics:
Depth of material removed by etch process
Depth of material removed by etch process, must be 0 .. 550 µm
0 .. 550 µm
Batch size 1
Edge profile
Free form text field for description of edge profile
Etch rate 1.6 µm/min
Material silicon
Primary material removal rate divided by removal rates of secondary materials (i.e., factors by which primary material is removed faster than secondary materials)
photoresist (category): 75, silicon: 1
Sides processed either
Temperature 25 °C
Wafer size
Wafer size
Equipment STS RIE
Equipment characteristics:
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
Wafer thickness
List or range of wafer thicknesses the tool can accept
100 .. 1000 µm