Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
on front
  I-line develop (OiR 897 10i)
Developer
Agent that reacts with masking layer (e.g., photoresist) to etch it selectively.
 Olin OPD 4262
Etch rate 1 µm/min
Material Arch OiR 897-10i
Selectivity
Primary material removal rate divided by removal rates of secondary materials (i.e., factors by which primary material is removed faster than secondary materials)
 Arch OiR 897-10i: 1
Setup time 30 min
Sides processed either
Temperature 23 °C
Wafer size
Wafer size
Equipment SVG-8132CTD Develop Track
Equipment characteristics:
Wafer geometry
Types of wafers this equipment can accept
 1-flat, 2-flat
Wafer holder
Device that holds the wafers during processing.
 vacuum chuck
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
 silicon
Wafer thickness
List or range of wafer thicknesses the tool can accept
 300 .. 1000 µm