Process Hierarchy

on front
  Aluminum plasma etch
Process characteristics:
Depth of material removed by etch process
Depth of material removed by etch process, must be 0 .. 2 µm
0 .. 2 µm
Ambient to which substrate is exposed during processing
boron trichloride, chlorine, nitrogen, sulfur hexafluoride
Batch size 4
Etch rate 0.6 µm/min
Loading effects
Free form text field for description of loading effects (e.g. bullseye)
Highly sensitive
Material aluminum
Min feature size 1 µm
Pressure of process chamber during processing
200 mTorr
Primary material removal rate divided by removal rates of secondary materials (i.e., factors by which primary material is removed faster than secondary materials)
aluminum: 1, photoresist (category): 1.5, silicon dioxide: 6
Sides processed either
Temperature 80 °C
Wafer size
Wafer size
Equipment Applied Materials Precision 5000 (chamber A)
Equipment characteristics:
Wafer holder
Device that holds the wafers during processing.
mechanical clamp
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
silicon, quartz (single crystal), silicon on insulator, silicon germanium
Wafer thickness
List or range of wafer thicknesses the tool can accept
400 .. 750 µm
  • Etcher is MOS clean.
  • No Backside resist.
  • For Quartz substrates Al must be on backside.
  • Resist thicknesses of over 1.5um may burn.
  • Endpoint detection available, assuming etch stop material is oxide.