Register
or
Sign in
Advantages
Capabilities
Company
How to Start
About MEMS
Organic clean: View
Process Hierarchy
Bonding
Clean
Consulting
Deposition
Doping
Etch
LIGA
Lift off
Lithography
Mask making
Metrology
Miscellaneous
Packaging
Polishing
Process technologies
Thermal
Unique capabilities
If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at
engineering@mems-exchange.org
or call us at (703) 262-5368
Organic clean
Process characteristics:
Etchant
Specify preferred cleaning agent/etchant (if known).
Etchant
1165 PR remover
acetone
Dynasol 165
HF
HF (buffered)
HF [49%]
HF/nitric acid
HF/water [1:10]
HF/water [1:1]
HF/water [1:50]
hydrogen chloride
isopropyl alcohol
nitric acid/HF/water [1:2:1]
other
PRS 2000
PRS 3000
Shipley Remover 1112A
sulfuric acid/hydrogen peroxide
sulfuric acid/hydrogen peroxide [4:1]
sulfuric acid/hydrogen peroxide [98:2]
sulfuric acid/hydrogen peroxide [9:1]
Specify preferred cleaning agent/etchant (if known).
Process duration
Specify preferred cleaning time (if known).
Process duration
min
s
Specify preferred cleaning time (if known).
unconstrained
Temperature
Preferred cleaning temperature (if known).
Temperature
°C
Preferred cleaning temperature (if known).
unconstrained
Sides processed
both
Equipment
Comments:
Specific processes to remove organic contamination on substrates.