Register
or
Sign in
Advantages
Capabilities
Company
How to Start
About MEMS
Ultrasonic clean: View
Process Hierarchy
Bonding
Clean
Consulting
Deposition
Doping
Etch
LIGA
Lift off
Lithography
Mask making
Metrology
Miscellaneous
Packaging
Polishing
Process technologies
Thermal
Unique capabilities
If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at
engineering@mems-exchange.org
or call us at (703) 262-5368
Ultrasonic clean
Process characteristics:
Process duration
Specify preferred cleaning time (if known).
Process duration
min
s
Specify preferred cleaning time (if known).
unconstrained
Temperature
Preferred cleaning temperature (if known).
Temperature
°C
Preferred cleaning temperature (if known).
unconstrained
Sides processed
both
Equipment
Comments:
The substrates are cleaned using a wet solution that is placed in an ultrasonic bath to provide intense agitation of the liquid.