Process Hierarchy

on front
  Silicon ICP Etch
Process characteristics:
must be 0 .. 5 µm
0 .. 5 µm
Batch size 1
Etch rate 1.1 µm/min
Gas SF6, Ar
Material silicon
Sides processed either
Temperature 25 °C
Wafer size
Wafer size
Equipment VLR 700 Cluster - Fluorine Dielectric Etch Chamber
Equipment characteristics:
Wafer geometry
Types of wafers this equipment can accept
Wafer holder
Device that holds the wafers during processing.
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
quartz (fused silica), sapphire, silicon, silicon on insulator