Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
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  Surface fly-cutting
Process characteristics:
Thickness removed
Amount of material removed
Thickness removed*
Amount of material removed, must be 0 .. 500 µm
0 .. 500 µm
Material photoresist (category)
Sides processed either
Wafer size
Wafer size
Equipment Fly-cutting machine
Equipment characteristics:
Wafer geometry
Types of wafers this equipment can accept
 no-flat, 1-flat, 2-flat, notched
Wafer holder
Device that holds the wafers during processing.
 aluminum chuck
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
 glass (category), Pyrex (Corning 7740), quartz (single crystal), silicon
Wafer thickness
List or range of wafer thicknesses the tool can accept
 300 .. 1500 µm
Comments:
  • Used to trim the thickness of organic layers such as SU-8 and PMMA.
    Precision: +/- 10um.