Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
on front
  Selective polishing
Process characteristics:
Materials
Specify material(s) to be selectively removed by polishing.
Materials
Available  
Selected
Specify material(s) to be selectively removed by polishing.
Remaining material
Specify material to remain during polishing.
Remaining material
Specify material to remain during polishing.
Roughness
Required RMS roughness of the polished surface (if known).
Roughness
Required RMS roughness of the polished surface (if known).
unconstrained
Thickness removed
Thickness of material to be removed.
Thickness removed
Thickness of material to be removed.
unconstrained
Sides processed either
Equipment