Register
or
Sign in
Advantages
Capabilities
Company
How to Start
About MEMS
Lapping: View
Process Hierarchy
Bonding
Clean
Consulting
Deposition
Doping
Etch
LIGA
Lift off
Lithography
Mask making
Metrology
Miscellaneous
Packaging
Polishing
CMP
Lapping
Miscellaneous polishing
Process technologies
Thermal
Unique capabilities
If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at
engineering@mems-exchange.org
or call us at (703) 262-5368
on front
Lapping
Process characteristics:
Roughness
Required RMS roughness of the lapped/polished surface (if known).
Roughness
Å
µm
nm
Required RMS roughness of the lapped/polished surface (if known).
unconstrained
Thickness removed
Thickness of material to be removed from substrate.
Thickness removed
µm
Thickness of material to be removed from substrate.
unconstrained
Sides processed
either
Equipment