Process Hierarchy

on front
  Contact I-line exposure
Material Arch OiR 897-10i
Separation of mask and wafer (separation of 0 um indicates contact)
0 µm
Setup time 30 min
Sides processed either
Wavelength of light used during the exposure
365 nm
Wafer size
Wafer size
Equipment Karl Suss MA6 Mask Aligner
Equipment characteristics:
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat
Wafer holder
Device that holds the wafers during processing.
vacuum chuck
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
Wafer thickness
List or range of wafer thicknesses the tool can accept
300 .. 2000 µm