Process Hierarchy

  Photoresist Strip
Batch size 25
Etch rate 0.8 µm/min
Solutions and their concentrations.
PRS 2000
Material photoresist (category)
Sides processed both
Temperature 65 °C
Wafer size
Wafer size
Equipment Solvent wet bench
Equipment characteristics:
Wafer holder
Device that holds the wafers during processing.
teflon carrier
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
silicon, glass (category)
Wafer thickness
List or range of wafer thicknesses the tool can accept
200 .. 800 µm
  • Exposed photoresist on wafers.