Process Hierarchy

on front
  Stylus profilometer step measurement
Batch size 1
Contact force
Force applied at contact point
5 mN
Depth 2000 µm
Measurement aspect thickness
Measurement unit nm
Setup time 20 min
Sides inspected
The sides of the wafer inspected by the process
Wafer size
Wafer size
Equipment KLA-Tencor Alpha-Step IQ surface profiler
Equipment characteristics:
MOS clean no
Piece dimension
Range of wafer piece dimensions the equipment can accept
1 .. 100 mm
Piece geometry
Geometry of wafer pieces the equipment can accept
irregular, other, rectangular
Piece thickness
Range of wafer piece thickness the equipment can accept
0.3 .. 21 mm
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat, no-flat, notched
Wafer holder
Device that holds the wafers during processing.
aluminum plate
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
Borofloat (Schott), Pyrex (Corning 7740), silicon, silicon on insulator
Wafer thickness
List or range of wafer thicknesses the tool can accept
0.3 .. 21 mm