Process Hierarchy

  Single Point, Ellipsometric Film Thickness Measurement (Rudolph)
Film thickness 0.01 .. 2 µm
Materials silicon dioxide on silicon, silicon nitride on silicon
Refractive index 1 .. 4
Wafer size
Wafer size
Equipment Rudolph Ellipsometer
Equipment characteristics:
Batch sizes 50 .. 150 mm: 1
Piece dimension
Range of wafer piece dimensions the equipment can accept
50 .. 150 mm
Piece geometry
Geometry of wafer pieces the equipment can accept
circular, irregular, other, rectangular, triangular shard
Piece thickness
Range of wafer piece thickness the equipment can accept
200 .. 800 µm
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat, no-flat, notched
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
silicon, silicon carbide, silicon on insulator
Wafer thickness
List or range of wafer thicknesses the tool can accept
200 .. 800 µm