Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
on front
  Optical Exposure
Feature geometry
Shape of feature with dimensions characterized by the minimum feature size
 equal line space
Field geometry
Shape of field with dimensions characterized by the maximum field size
 circle
Min feature size 2 µm
Sides processed either
Wafer size
Wafer size
Equipment EVG 420 Aligner
Equipment characteristics:
Wafer geometry
Types of wafers this equipment can accept
 1-flat, 2-flat, no-flat
Wafer holder
Device that holds the wafers during processing.
 metal chuck
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
 quartz (single crystal), silicon on insulator, silicon, Pyrex (Corning 7740)
Wafer thickness
List or range of wafer thicknesses the tool can accept
 100 .. 3000 µm