Process Hierarchy

  Photoresist Stripping (Ion 40)
Depth 0.1 .. 10 µm
Etch type dry isotropic
Material photoresist (category)
Wafer size
Wafer size
Equipment Metroline / IPC Plasma Photoresist Stripper
Equipment characteristics:
Batch sizes 100 mm: 3, 150 mm: 3, 200 mm: 1, 50 mm: 3, 75 mm: 3
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat, no-flat, notched
Wafer holder
Device that holds the wafers during processing.
aluminum plate
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
gallium arsenide, silicon, silicon on insulator
Wafer thickness
List or range of wafer thicknesses the tool can accept
200 .. 700 µm