Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
  SEM Wafer Inspection
Batch size 1
Chuck type SEM stage & sample holder
Energy
Energy used during process
 500 .. 30000 eV
Magnifications 50 .. 500000
Materials aluminum oxide (category), chromium, chromium/gold, gallium arsenide, gold, nickel, platinum, PMMA, polysilicon, silicon (doped), silicon carbide, silicon dioxide, silicon nitride, silicon nitride on silicon dioxide, silicon on insulator, titanium
Wafer size
Wafer size
Equipment Hitachi SEM
Equipment characteristics:
Piece dimension
Range of wafer piece dimensions the equipment can accept
 3 .. 100 mm
Piece geometry
Geometry of wafer pieces the equipment can accept
 circular, irregular, other, rectangular
Piece thickness
Range of wafer piece thickness the equipment can accept
 200 .. 700 µm
Wafer geometry
Types of wafers this equipment can accept
 1-flat, 2-flat, no-flat, notched
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
 alumina, gallium arsenide, silicon, silicon carbide, titanium
Wafer thickness
List or range of wafer thicknesses the tool can accept
 200 .. 700 µm