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Capabilities
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How to Start
About MEMS
Microscope inspection: View
Process Hierarchy
Bonding
Clean
Consulting
Deposition
Doping
Etch
LIGA
Lift off
Lithography
Mask making
Metrology
Electrical metrology
Geometric metrology
Miscellaneous metrology
Miscellaneous
Packaging
Polishing
Process technologies
Thermal
Unique capabilities
If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at
engineering@mems-exchange.org
or call us at (703) 262-5368
on front
Microscope inspection
Batch size
1
Magnifications
5, 10, 20, 50, 100
Sides inspected
The sides of the wafer inspected by the process
either
Wafer size
Wafer size
25 .. 200 mm
Equipment
Leitz Ergolux
Equipment characteristics:
Wafer holder
Device that holds the wafers during processing.
glass plate
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
silicon
Wafer thickness
List or range of wafer thicknesses the tool can accept
300 .. 5000 µm
Comments:
Knowledge of whether a filter must be used or not.