on front 10X stepper G-line exposure Down |
|
| Magnification |
10 |
|---|
| Material |
OCG 825 35CS |
|---|
| Max field size |
8.25 mm |
|---|
| Setup time |
30 min |
|---|
| Sides processed |
either |
|---|
| Wavelength Wavelength of light used during the exposure |
436 nm |
|---|
| Wafer size |
|
|---|
| Equipment |
GCA 6200 Wafer Stepper |
| Equipment characteristics: |
| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat |
|---|
| Wafer holder Device that holds the wafers during processing. |
vacuum chuck |
|---|
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon |
|---|
| Wafer thickness List or range of wafer thicknesses the tool can accept |
300 .. 600 µm |
|---|
| Comments: |
|
