Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
on front
  Stepper front-front alignment Down
Alignment side front
Alignment tolerance
Registration of CAD data to features on wafer
 2 µm
Feature geometry
Shape of feature with dimensions characterized by the minimum feature size
 line
Max field size 8.25 mm
Min feature size 1 µm
Setup time 30 min
Sides processed either
Wafer size
Wafer size
Equipment GCA 6200 Wafer Stepper
Equipment characteristics:
Wafer geometry
Types of wafers this equipment can accept
 1-flat, 2-flat
Wafer holder
Device that holds the wafers during processing.
 vacuum chuck
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
 silicon
Wafer thickness
List or range of wafer thicknesses the tool can accept
 300 .. 600 µm
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