Process Hierarchy

on front
  Microscope inspection
Batch size 1
Magnifications 5, 10, 20, 50, 100
Setup time 30 min
Sides inspected
The sides of the wafer inspected by the process
Wafer size
Wafer size
Equipment Olympus microscope
Equipment characteristics:
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat
Wafer holder
Device that holds the wafers during processing.
plastic table
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
Wafer thickness
List or range of wafer thicknesses the tool can accept
300 .. 2500 µm
  • 10 mins of optical inspection for residue, physical damages, or discoloration of the samples. The observations will be reported in the runcard.