Photoresist develop (Shipley 1813) |
|
| Batch size |
1 |
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| Developer Agent that reacts with masking layer (e.g., photoresist) to etch it selectively. |
MF-319 |
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| Material |
Shipley 1813 |
|---|
| Selectivity Primary material removal rate divided by removal rates of secondary materials (i.e., factors by which primary material is removed faster than secondary materials) |
Shipley 1813: 1 |
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| Sides processed |
both |
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| Temperature |
25 °C |
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| Wafer size |
|
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| Equipment |
Wet etch bench |
| Equipment characteristics: |
| Piece dimension Range of wafer piece dimensions the equipment can accept |
1 .. 150 mm |
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| Piece geometry Geometry of wafer pieces the equipment can accept |
rectangular |
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| Piece thickness Range of wafer piece thickness the equipment can accept |
200 .. 1000 µm |
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| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat |
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| Wafer holder Device that holds the wafers during processing. |
teflon boat, teflon carrier |
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| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
quartz (fused silica), Pyrex (Corning 7740), silicon on insulator, silicon, ceramic |
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| Wafer thickness List or range of wafer thicknesses the tool can accept |
200 .. 1000 µm |
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| Comments: |
|
