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About MEMS
X-ray mask making: View
Process Hierarchy
Bonding
Clean
Consulting
Deposition
Doping
Etch
LIGA
Lift off
Lithography
Mask making
Metrology
Miscellaneous
Packaging
Polishing
Process technologies
Thermal
Unique capabilities
If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at
engineering@mems-exchange.org
or call us at (703) 262-5368
on front
X-ray mask making
Process characteristics:
Gold thickness
Gold thickness
*
10.0 um
30.0 um
Thickness removed
Amount of material removed
0 .. 0.5 µm
Comments:
Used for LIGA processes.
After fabrication the mask is
tested in the X-ray beam line.
Pricing available upon request.