Process Hierarchy

  Nickel LIGA (fully anchored structures) (Type 1 mold insert)
Process characteristics:
Nickel thickness
Nickel thickness*
must be 500 .. 2000 µm
500 .. 2000 µm
Aspect ratio 10
Batch size 1
Mold height uniformity 7 µm
Mold sidewall roughness 200 nm
Smallest feature size 50 µm
Wafer diameter(s)
List or range of wafer diameters the tool can accept
123.825 mm
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
stainless steel
Wafer thickness
List or range of wafer thicknesses the tool can accept
0.25 inch
Wafer size
Wafer size
  • The layout will be reviewed by Mezzo Systems.
  • The effective pattern area is 3.5inch in diameter.
  • The wafer is provided by Mezzo Systems.
  • The standard aspect ratio for the mold inserts used in hot embossing is 7. Please contact Mezzo Systems for higher aspect ratios.
  • Defect criteria < 3 defects/inch2 at 5um size.
  • The estimated lead time is for this process 8-10 weeks.