Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
on front
  Maskless photolithography (front-front align) (Rogers R/Flex 8080)
  1 Dehydration bake
on front
  2 Photoimageable covercoat (Rogers R/Flex 8080)
MaterialRogers R/Flex 8080
on front
  3 Maskless Alignment
on front
  4 Maskless Exposure
  5 Photoimageable covercoat develop (Rogers R/Flex 8080)
MaterialRogers R/Flex 8080
on front
  6 Microscope inspection
Process characteristics:
Resist thickness
Thickness of photoresist.
Resist thickness
Thickness of photoresist., must be 15 .. 25 µm
15 .. 25 µm
Batch size 1
Material Rogers R/Flex 8080
Sides processed either
Wafer size
Wafer size
Comments:
  • $100.00 setup fee.
  • Minimum of 4 wafers.
  • Minimum feature size is 50 um.
  • Rogers R/Flex 8080 is a NEGATIVE photoresist.