Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
on front
  Maskless photolithography (front-front align) (Shipley 220)
on front
  1 Photoresist coat (Shipley 220)
MaterialShipley 220
  2 Photoresist softbake II
on front
  3 Maskless Alignment
on front
  4 Maskless Exposure
  5 Post-exposure bake
  6 Photoresist develop (Shipley 220)
MaterialShipley 220
on front
  7 Microscope inspection
Process characteristics:
Resist thickness
Thickness of photoresist.
Resist thickness
Thickness of photoresist. , must be 10 .. 80 µm
10 .. 80 µm
Batch size 1
Material Shipley 220
Sides processed either
Wafer size
Wafer size
Comments:
  • $100.00 setup fee.
  • Minimum of 4 wafers.