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About MEMS
Pre-furnace clean: View
Process Hierarchy
Bonding
Clean
Consulting
Deposition
Doping
Etch
LIGA
Lift off
Lithography
Mask making
Metrology
Miscellaneous
Packaging
Polishing
Process technologies
Thermal
Unique capabilities
If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at
engineering@mems-exchange.org
or call us at (703) 262-5368
Pre-furnace clean
1
RCA clean
2
HF dip
Batch size
25
Wafer size
Wafer size
100 mm
Comments:
This is the standard pre-furnace (deposition and oxidation) clean at Michigan.