Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
  Pre-LPCVD clean
  1 4:1 Sulfuric/peroxide bath
  2 HCl bath
  3 50:1 HF dip
Wafer size
Wafer size
Comments:
  • No metals or silicides on wafer
  • First step (piranha clean) only applies to wafers with resist or just scribed.
  • Doesn't etch Si or Si3N4.