Process Hierarchy

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  Photoresist ashing (non-clean)
Batch size 1
Material photoresist (category)
Primary material removal rate divided by removal rates of secondary materials (i.e., factors by which primary material is removed faster than secondary materials)
photoresist (category): 1
Sides processed either
Temperature 25 °C
Wafer size
Wafer size
Equipment SemiGroup RIE
Equipment characteristics:
MOS clean no
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat, notched, no-flat
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
silicon, silicon on insulator, glass (category)
Wafer thickness
List or range of wafer thicknesses the tool can accept
200 .. 1000 µm