Process Hierarchy

on front
  Contact front-front alignment (MA6)
Alignment side front
Field geometry
Shape of field with dimensions characterized by the maximum field size
Max field size 150 mm
Min feature size 2 µm
Sides processed either
Wafer size
Wafer size
Equipment Karl Suss MA6 mask aligner
Equipment characteristics:
Batch sizes 100 mm: 1, 150 mm: 1, 75 mm: 1
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat, no-flat, notched
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
Borofloat (Schott), glass (Hoya), Pyrex (Corning 7740), quartz (fused silica), silicon, silicon on insulator
Wafer thickness
List or range of wafer thicknesses the tool can accept
100 .. 1000 µm