|
| Process characteristics: |
| Depth |
|
|---|
| Batch size |
1 |
|---|
| Etchant Solutions and their concentrations. |
Shipley Remover 1112A |
|---|
| Feature geometry Shape of feature with dimensions characterized by the minimum feature size |
line |
|---|
| Material |
Shipley 1827 |
|---|
| Min feature size |
5 µm |
|---|
| Sides processed |
both |
|---|
| Wafer size |
|
|---|
| Equipment |
Wet etch bench |
| Equipment characteristics: |
| Piece dimension Range of wafer piece dimensions the equipment can accept |
1 .. 150 mm |
|---|
| Piece geometry Geometry of wafer pieces the equipment can accept |
rectangular |
|---|
| Piece thickness Range of wafer piece thickness the equipment can accept |
200 .. 1000 µm |
|---|
| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat |
|---|
| Wafer holder Device that holds the wafers during processing. |
teflon boat, teflon carrier |
|---|
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
quartz (fused silica), Pyrex (Corning 7740), silicon on insulator, silicon, ceramic |
|---|
| Wafer thickness List or range of wafer thicknesses the tool can accept |
200 .. 1000 µm |
|---|
| Comments: |
|
