Process Hierarchy

  Lift-off etch
Process characteristics:
must be 1 .. 5 µm
1 .. 5 µm
Batch size 1
Solutions and their concentrations.
Shipley Remover 1112A
Feature geometry
Shape of feature with dimensions characterized by the minimum feature size
Material Shipley 1827
Min feature size 5 µm
Sides processed both
Wafer size
Wafer size
Equipment Wet etch bench
Equipment characteristics:
Piece dimension
Range of wafer piece dimensions the equipment can accept
1 .. 150 mm
Piece geometry
Geometry of wafer pieces the equipment can accept
Piece thickness
Range of wafer piece thickness the equipment can accept
200 .. 1000 µm
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat
Wafer holder
Device that holds the wafers during processing.
teflon boat, teflon carrier
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
quartz (fused silica), Pyrex (Corning 7740), silicon on insulator, silicon, ceramic
Wafer thickness
List or range of wafer thicknesses the tool can accept
200 .. 1000 µm
  • Includes ultrasonic agitation.