Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
  1X E-beam mask
Process characteristics:
Beam spot diameter
Area of the beam used to write the mask.
Use the diameter value that is equal to or smaller than 1/8th of min. feature size.
(This field is optional.)
Beam spot diameter*
Area of the beam used to write the mask. Use the diameter value that is equal to or smaller than 1/8th of min. feature size. (This field is optional.)
Mask material
Mask material*
Mask plate dimension
Size of mask plate to be made
Mask plate dimension*
Size of mask plate to be made
Min feature size
Specify smallest feature or gap on mask
Min feature size*
Specify smallest feature or gap on mask, must be 1 .. 10000 µm
1 .. 10000 µm
Batch size 1
Critical dimension tolerance 0.25 µm
Defect density
Density (by area) of defects of a given size (e.g., 1dpsi@1.0um).
 1dpsi@1.5um (MI)
Magnification 1
Mask coating
Mask coating material (eg. chrome).
 chromium
Equipment
Comments:
  • Minimum feature sizes: 3um for 0.5um spot size; 2um for 0.25um spot size; 1um for 0.1um spot size.
  • Pricing includes 90 minutes of write time. Charge over 90 minutes is $15 per minute, not to exceed 1X base price.