Wafer curvature measurement with stress calculation |
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| Batch size |
1 |
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| Measurement unit |
mm, m |
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| Thickness |
0.01 .. 5 µm |
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| Wafer size |
|
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| Equipment |
Tencor FLX 2908 Wafer Curvature (Stress) Measurement |
| Equipment characteristics: |
| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat, no-flat, notched |
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| Wafer holder Device that holds the wafers during processing. |
quartz |
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| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon, silicon on insulator |
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| Wafer thickness List or range of wafer thicknesses the tool can accept |
200 .. 600 µm |
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