Process Hierarchy

  Wafer curvature measurement with stress calculation
Batch size 1
Measurement unit mm, m
Thickness 0.01 .. 5 µm
Wafer size
Wafer size
Equipment Tencor FLX 2908 Wafer Curvature (Stress) Measurement
Equipment characteristics:
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat, no-flat, notched
Wafer holder
Device that holds the wafers during processing.
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
silicon, silicon on insulator
Wafer thickness
List or range of wafer thicknesses the tool can accept
200 .. 600 µm