Process Hierarchy

  Microscope inspection
Line width 1 .. 40 µm
Magnifications 2.5, 10, 20, 50, 100
Materials silicon carbide, silicon nitride on silicon dioxide, silicon nitride on silicon, PMMA, photoresist on silicon, photoresist on silicon nitride, silicon dioxide, photoresist on silicon dioxide
Wafer size
Wafer size
Equipment Leitz Ergolux Microscope
Equipment characteristics:
Batch sizes 100 mm: 1, 150 mm: 1, 50 mm: 1, 75 mm: 1
Piece geometry
Geometry of wafer pieces the equipment can accept
circular, irregular, other, rectangular, triangular shard
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat, no-flat, notched
Wafer holder
Device that holds the wafers during processing.
metal chuck
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
gallium arsenide, gallium phosphide, indium phosphide, Pyrex (Corning 7740), quartz (fused silica), quartz (single crystal), sapphire, silicon, silicon carbide, silicon on insulator
  • Unless any additional inspection sites are specified, this step will include inspection of only two CD features per wafer.
  • If resolution structures are included in the mask, their images will be taken and posted in the runcard.
  • For any other or additional inspection, the customer will specify the location and nature of inspection, and it will be custom quoted.