Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
  5X E-beam ASML reticle mask
Process characteristics:
Beam spot diameter
Area of the beam used to write the mask
Beam spot diameter*
Area of the beam used to write the mask
Defect density
Density (by area) of defects of a given size (e.g., 1dpsi@1.0um).
Defect density*
Density (by area) of defects of a given size (e.g., 1dpsi@1.0um).
Batch size 1
Critical dimension tolerance 0.25 µm
Magnification 5
Mask coating
Mask coating material (eg. chrome).
 chromium
Mask material quartz (fused silica)
Mask plate dimension 6x6x0.25"
Equipment
Comments:
  • For a 2um feature a 0.25um beam diameter or smaller is recommended.
  • 5X ASML 5500/90
  • Pricing includes 90 minutes of write time. Charge over 90 minutes is $12.00 per minute, not to exceed 1x base price.