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About MEMS
1X PG mask: View
Process Hierarchy
Bonding
Clean
Consulting
Deposition
Doping
Etch
LIGA
Lift off
Lithography
Mask making
Metrology
Miscellaneous
Packaging
Polishing
Process technologies
Thermal
Unique capabilities
If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at
engineering@mems-exchange.org
or call us at (703) 262-5368
1X PG mask
Process characteristics:
Flash count
Number of flashes neccessary for a single mask plate
Flash count
*
Number of flashes neccessary for a single mask plate, must be 5000 .. 100000
5000 .. 100000
Mask material
Mask material
*
quartz (fused silica)
soda lime
Batch size
1
Critical dimension tolerance
2 µm
Feature geometry
Shape of feature with dimensions characterized by the minimum feature size
line
Magnification
1
Mask coating
Mask coating material (eg. chrome).
chromium
Mask plate dimension
5"x5"x0.09"
Min feature size
2 µm
Equipment