Process Hierarchy

  Piranha clean (non-MOS clean)
Material concentrations sulfuric acid/hydrogen peroxide [98:2]
Process duration 15 min
Sides processed both
Temperature 120 °C
Wafer size
Wafer size
Equipment Wet Bench
Equipment characteristics:
Batch sizes 25 .. 200 mm: 1
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat, no-flat, notched
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
Pyrex (Corning 7740), silicon, silicon on insulator
Wafer thickness
List or range of wafer thicknesses the tool can accept
200 .. 3000 µm