Process Hierarchy

  Piranha Clean
Solutions and their concentrations.
sulfuric acid/hydrogen peroxide
Sides processed both
Temperature 60 .. 70 °C
Time 20 min
Wafer size
Wafer size
Equipment Wet Bench (acid)
Equipment characteristics:
Batch sizes 100 mm: 25, 150 mm: 25, 75 mm: 25
Piece dimension
Range of wafer piece dimensions the equipment can accept
0 .. 100 mm
Piece geometry
Geometry of wafer pieces the equipment can accept
triangular shard, other, rectangular, irregular, circular
Piece thickness
Range of wafer piece thickness the equipment can accept
300 .. 800 µm
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat, notched, no-flat
Wafer holder
Device that holds the wafers during processing.
teflon carrier
Wafer thickness
List or range of wafer thicknesses the tool can accept
300 .. 800 µm
  • A wet chemical solution containing sulphuric acid and hydrogen peroxide, used primarily to clean substrates for organic contamination.
  • No metals.
  • Batch size depends on geometry.