Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
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  SEM sample analysis
Process characteristics:
Duration
Duration os SEM inspection
Duration*
Duration os SEM inspection, must be 2 .. 100 hour
2 .. 100 hour
Batch size 1
Magnifications 100 .. 300000
Sides inspected
The sides of the wafer inspected by the process
 either
Wafer size
Wafer size
Equipment AMRAY 3600 Field Emission SEM
  • Multiple-sample holder can hold up to 15 small pieces.
  • Has a Noran System 6 energy dispersive x-ray detection system for elemental analysis.
Equipment characteristics:
Piece dimension
Range of wafer piece dimensions the equipment can accept
 0 .. 8 inch
Piece geometry
Geometry of wafer pieces the equipment can accept
 circular, irregular, other, rectangular, triangular shard
Piece thickness
Range of wafer piece thickness the equipment can accept
 0 .. 1 inch
Wafer geometry
Types of wafers this equipment can accept
 1-flat, 2-flat, no-flat, notched
Wafer holder
Device that holds the wafers during processing.
 aluminum chuck
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
 alumina, BK7, Borofloat (Schott), ceramic, copper, Corning 1737, Foturan (Schott), fused silica, gallium arsenide, gallium phosphide, germanium, glass (Hoya), glass-ceramic, indium phosphide, lithium niobate, other, Pyrex (Corning 7740), quartz (fused silica), quartz (single crystal), sapphire, silicon, silicon carbide, silicon germanium, silicon on insulator, silicon on sapphire, titanium
Wafer thickness
List or range of wafer thicknesses the tool can accept
 0 .. 1 inch
Comments:
  • Two-hour minimum charge.