on front EDX material analysis |
|
| Batch size |
1 |
|---|
| Sides inspected The sides of the wafer inspected by the process |
either |
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| Wafer size |
|
|---|
| Equipment |
AMRAY 3600 Field Emission SEM
|
| Equipment characteristics: |
| Piece dimension Range of wafer piece dimensions the equipment can accept |
0 .. 8 inch |
|---|
| Piece geometry Geometry of wafer pieces the equipment can accept |
circular, irregular, other, rectangular, triangular shard |
|---|
| Piece thickness Range of wafer piece thickness the equipment can accept |
0 .. 1 inch |
|---|
| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat, no-flat, notched |
|---|
| Wafer holder Device that holds the wafers during processing. |
aluminum chuck |
|---|
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
alumina, BK7, Borofloat (Schott), ceramic, copper, Corning 1737, Foturan (Schott), fused silica, gallium arsenide, gallium phosphide, germanium, glass (Hoya), glass-ceramic, indium phosphide, lithium niobate, other, Pyrex (Corning 7740), quartz (fused silica), quartz (single crystal), sapphire, silicon, silicon carbide, silicon germanium, silicon on insulator, silicon on sapphire, titanium |
|---|
| Wafer thickness List or range of wafer thicknesses the tool can accept |
0 .. 1 inch |
|---|
| Comments: |
|
