|
| Batch sizes |
150 mm: 1 |
|---|
| Depth |
300 .. 350 mm |
|---|
| Diameter |
100 mm |
|---|
| Wafer size |
|
|---|
| Equipment |
STS DRIE |
| Equipment characteristics: |
| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat, no-flat |
|---|
| Wafer holder Device that holds the wafers during processing. |
electrostatic chuck |
|---|
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon, silicon on insulator |
|---|
| Wafer thickness List or range of wafer thicknesses the tool can accept |
100 .. 750 µm |
|---|
| Comments: |
|
