Process Hierarchy

on front
  Photoresist develop (Shipley 220)
Batch size 1
Agent that reacts with masking layer (e.g., photoresist) to etch it selectively.
Material Shipley 220
Primary material removal rate divided by removal rates of secondary materials (i.e., factors by which primary material is removed faster than secondary materials)
Shipley 220: 1
Sides processed either
Temperature 90 °C
Wafer size
Wafer size
Equipment SVG-8132CTD Develop Track
Equipment characteristics:
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat
Wafer holder
Device that holds the wafers during processing.
vacuum chuck
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
Wafer thickness
List or range of wafer thicknesses the tool can accept
300 .. 1000 µm